GY-521 MPU-6050 Module 3 Axis Accelerometer Analog Gyro Sensor L299
– PCB Process for Gold Deposition
– Using chips: MPU6050 HMC5883L BMP180
– Power supply: 3 5v
– Communication mode: IIC communication protocol (fully compatible with 3 5v system, including LLC circuit)
– Dimension: 22mm x 17mm x 3mm / 0.86 0.66 0.11
– Please allow 1 3mm differs due to manual measurement.
– Due to the different display and different light, the picture may not show the actual color of the item. Thanks for your understanding.